Molex Upgrades ParaLink

May 28, 2003 12:00 PM, Editors

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Molex has added a 3.2Gbps version to its ParaLink Parallel Optical Interconnect product line. The ParaLink module is a pluggable 12-channel parallel module for high-speed, high-density optical-data transfer applications. This enhanced version increases throughput by 25% over more commonly available devices at 2.5Gbps per channel.

The new ParaLink modules are compatible with the new generation of XAUI interface chips. The modules can transmit optical data over 300 meters of multimode fiber depending on type of fiber.

The company's ParaLink-P devices come as a set of separate 12-channel transmitter and receiver modules. The transmitter is based on a Vertical Cavity Surface Emitting Laser array (VCSEL) with active bias and modulation feedback to provide constant optical output over operating range and lifetime. The devices operate on a 3.3-volt supply and typically draw only 250 mA, providing a very low-power consumption, typically 1.6 watts per link. These modules plug into a 10x10 BGA socket previously mounted on the motherboard, allowing for a more flexible final assembly, test and repair process.

ParaLink pluggable modules have been designed with a low profile of 8.4 mm to enable use with PCI-compliant cards and other height-constrained applications. Modules have a compact 54x18mm size layout, and the devices are available with an EMI shroud to provide EMI suppression for front-panel-mounted applications. The optical interface is an MPO receptacle that allows for easy connection to standard 12-fiber MT-based ribbon cable. Through a cross-licensing agreement, all Molex ParaLink-P modules are fully pin-out compliant and interoperable with Infineon’s PAROLI 2 pluggable parallel optical interconnect devices.

ParaLink 3.125G modules are available now. Pricing starts at less than $1,000 per transmitter and receiver pair. For more information on the Molex ParaLink-P, or other fiber optic products, visit www.molex.com.






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